Koch Chemie

Koch Chemie Micro Cut Pad 3"/5"/6"

  • Foam polishing pad
  • Removes light scratches and holograms
  • Gives a high gloss result
  • 23 mm pad depth creates highest level of stability
  • Milling edge ensures extra flexibility for the pads
  • Machine washable
  • Abrasiveness: 5
  • Compression Hardness: 10

Koch-Chemie's Micro Cut Pad is a high-quality special sponge for removing fine scratches, holograms and polishing marks using Koch-Chemie's Micro Cut M3.02 and/or Micro Cut & Finish P3.01 Polishing Compounds.

The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier.

The colourful non-woven material, suitable for polishing, ensures process safety.